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Silicone Thermal Conductive Gap Pad For Memory Modules

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Silicone Thermal Conductive Gap Pad For Memory Modules

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Brand Name : Ziitek

Model Number : TIF120-30-06US thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

hardness : 18 shore00

KEYWORD : white silicone rubber pads

color : white

part number : TIF120-30-06US

material : silicone

thermal conductive : 3.0W/mK

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China company supplied Easy release construction thermal conductive gap pad for Memory Modules ,18 shore00,3.0W/mK


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


TIF100-30-06US.pdf

TIF120-30-06US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features
<Good thermal conductive:3.0W/mK
<Thickness:0.5mmT
<Hardness:18 Shore 00
<Colour: white

<Good thermal conductive

<Moldability for complex parts

<Soft and compressible for low stress applications

Applications

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

<Automotive electronics


Typical Properties of TIF120-30-06US
Product Name

TIF120-30-06US Series
Colour
 white
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity
3.0 g/cc

Thickness
0.5mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Silicone Thermal Conductive Gap Pad For Memory Modules
Silicone Thermal Conductive Gap Pad For Memory Modules

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.



FAQ

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


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