CPU Thermal Pad Silicone Based Thermal Interface Material With Flame Retardant And 2.9 Grams Per Cubic Centimeter Density
Company Profile
Ziitek is a high-tech enterprise dedicated to the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in this field, we provide the latest, most effective thermal management solutions. Our facility features advanced production equipment, comprehensive testing capabilities, and fully automatic coating production lines for high-performance thermal products including thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products comply with UL94 V-0, SGS, and ROHS standards.
Product Description
TIF®100-19S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and superior ease of use, effectively transferring heat while providing basic physical protection for a wide range of electronic components.
Features
- Good thermal conductivity
- Good softness and fillability
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
Applications
- Home appliance industry
- Power module
- Wearable devices
- Solar photovoltaic panels
- LED lighting fixtures
- Routers
- Medical devices
- Audio electronic products
- Unmanned aerial vehicles (UAV)
- Photovoltaic systems
- Signal communication
- New energy vehicles
Typical Properties of TIF®100-19S Series
| Property |
Value |
Test Method |
| Color |
Yellow |
Visual |
| Construction |
Ceramic filled silicone elastomer |
****** |
| Density (g/cm³) |
2.3 |
ASTM D792 |
| Thickness Range (inch/mm) |
0.010~0.020 (0.25~0.50)
0.030~0.200 (0.75~5.00) |
ASTM D374 |
| Hardness (Shore 00) |
65 | 45 |
ASTM 2240 |
| Continuous Use Temp |
-40 to 200℃ |
*** |
| Breakdown Voltage (V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant @1MHz |
4.5 |
ASTM D150 |
| Volume Resistivity |
＞1.0×10¹² Ohm-meter |
ASTM D257 |
| Thermal Conductivity (W/m-K) |
1.5 |
ASTM D5470
ISO22007 |
| Fire rating |
V-0 |
UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Why Choose Us?
- Our value message is "Do it right the First time, total quality control"
- Our core competency is thermal conductive interface materials
- Competitive advantage products
- Confidentiality agreement and Business Secret Contract
- Free sample offer
- Quality assurance contract
Frequently Asked Questions
Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Our customization options include dimensions, shape, color, and coating on one or both sides with adhesive or fiberglass. To place a custom order, please provide a drawing or detailed specifications.
Q: How do I request customized samples?
A: To request samples, you can leave us a message on our website, or contact us via email or phone.
Q: What's the thermal conductivity test method given on the data sheet?
A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 methods are utilized to test thermal conductivity.
