Soft Thermal Interface Pad High Compressibility AI Accelerator Thermal Pad For CPU And GPU Cooling
Company Profile
Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong. We are a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. With production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam, we ensure efficient delivery and localized services worldwide.
Our product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, serving applications in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company holds IATF16949 and ISO9001 certifications, with products meeting ROHS, REACH and UL specifications.
Product Description
The TIF®100-30-01UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer with facilities in China and Vietnam.
What Is a Thermal Interface Material (TIM)?
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
What Is Thermal Conductivity? Is Higher Thermal Conductivity Always Better?
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
Why Do AI Servers Need High-Performance Thermal Interface Materials?
AI GPUs, CPUs and Application Specific Integrated Circuits generate high power and heat flux, requiring efficient heat transfer to heat sinks or cold plates. High-performance TIMs help reduce interface thermal resistance.
How Do I Choose the Right Thermal Interface Material?
Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.
What Thermal Interface Materials Does ZIITEK Offer?
ZIITEK focuses on thermal management materials and solutions for electronics. Our portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.
